STMicroelectronics Pushes PWD13F60 to Save 60% of Board Space and Improves Power Density of Final Applications

ST's PWD13F60 System-in-Package (SiP) product integrates a complete 600V/8A single-phase MOSFET full-bridge circuit in a 13mm x 11mm package for industrial motor drive controllers, lamp ballasts, power supplies, and power conversion Manufacturers and inverter manufacturers save on material costs and board space.

STMicroelectronics Pushes PWD13F60 to Save 60% of Board Space and Improves Power Density of Final Applications

Not only does this save 60% of board space compared to similar full-bridge circuits designed with discrete devices, the PWD13F60 can also increase the power density of the final application. The commercially available full-bridge module is usually a dual-FET half-bridge or six-FET three-phase product, while the PWD13F60 integrates four power MOSFETs, which is a particularly high energy efficiency alternative. Unlike these products, only one PWD13F60 can be used to complete a single-phase full-bridge design, leaving none of the internal MOSFETs to be idle. The new full bridge module can be flexibly configured as a full bridge or two half bridges.

Using ST's high-voltage BCD6s-Offline manufacturing process, the PWD13F60 integrates a power MOSFET gate driver and an upper-side arm to drive the bootstrap diode. The benefits of this design are simplified circuit board design, streamlined assembly, and external component savings. The gate driver has been optimized and improved to achieve high switching reliability and low EMI (electromagnetic interference). The system package also features cross conduction protection and undervoltage lock protection, which helps to further reduce the footprint and ensure system security.

Other features of the PWD13F60 include a wide operating voltage as low as 6.5V, providing maximum configuration flexibility and design simplicity. In addition, the new system package input pins also accept 3.3V-15V logic signals, making it easy to connect microcontrollers (MCUs), digital processors (DSPs), or Hall sensors.

The PWD13F60 is available today and is available in a high thermal efficiency multi-base VFQFPN package.

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