Amers Semiconductor's audio chip delivers world-class noise reduction for two new wireless headsets from trending brand FIIL

Amers Semiconductor has announced that headset manufacturer FIIL has adopted two chips from Amers Semiconductor in its new product.


AS3435 This Amers Semiconductor Hybrid Active Noise Reduction (ANC) audio IC is used in the high performance Canviis Pro wireless in-ear headphones. In addition, the first round-neck Bluetooth in-ear active noise canceling headphones Driifter Pro chose Amers Semiconductor's AS3412. Limited by the size of the headset, the AS3412 in a small wafer-level chip package is ideal for this type of application.


The growing popularity of the trend brand FIIL is due to its combination of superior audio performance, innovative features and chic design. Superior noise reduction performance in the audible spectrum has created FIIL's market-leading, unique product appeal. This is mainly due to the excellent active noise reduction performance of the Amers semiconductor chip, as well as support for professional system knowledge, design engineering and acoustic analysis services. Amers Semiconductor's active noise reduction IC products have the leading edge in the market, combining superior audio performance with low power consumption.


The advanced noise reduction features of Amers Semiconductor's audio sensor products include:

Intelligent noise adjustment - three modes of operation are available for the user to choose. The chip typically operates in noise reduction mode, but also provides a listening mode for removing low frequency noise for the user to hear mid to high frequency sounds, while the open mode allows the user to hear all ambient noise.


Wind noise mode - counteracts the noise caused by the wind.

The Canviis Pro in-ear headphones with the AS3435 active noise reduction chip deliver world-class active noise reduction with over 30dB noise reduction and less than 0.5% total harmonic distortion (100dBSPL).


Driifter Pro in-ear headphones require a chip with good noise reduction capability and can be placed in a small end product housing with very low power consumption for long hours of operation with a small battery. FIIL's AS3412 chip is only 2.2 mm x 2.2 mm x 0.4mm and is available in a wafer-level chip package. When the operating supply voltage is 1.6 V - 1.8V, the AS3412 consumes only 8mW.

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