Solder is a tin-lead alloy made of a combination of tin and lead in a certain proportion, in which tin is the main material. Today's solders use automatic soldering machines to replace traditional manual soldering. Pure tin (Sn) is silvery white, shiny, ductile, and resistant to oxidation in air. Its melting point is 232 °C. Tin can be alloyed with most metals. However, the pure tin material is brittle. In order to increase the flexibility of the solder and lower the melting temperature of the solder, another metal must be fused with tin to alleviate the properties of the tin.
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Lead is a very good ingredient. Pure lead (Pb) is blue-gray, soft and heavy, malleable, but easily oxidized and toxic. Its melting point is 327 °C. When tin and lead are fused in proportion, it constitutes that our melting point temperature becomes low, easy to use, and can be combined with most metals; it has the characteristics of low price, good electrical conductivity and reliable connection of electronic components.
Welding is a relatively complicated physical and chemical process. When soldering copper is used, with the help of the soldering iron tip and the help of the flux, the solder first wets the soldering surface and gradually diffuses to the metal copper, in the solder and metal copper. The contact surface forms an adhesion layer, which forms a firm and reliable solder joint after cooling. The process can be divided into the following three steps:
The first step is to moisturize. The wetting process means that the solder that has been melted flows along the fine concavities and convexities of the surface of the metal to be welded by capillary force, thereby forming an adhesion layer on the surface of the metal to be welded, so that the atoms of the solder are close to each other to achieve atomic gravity. The distance that works. The environmental conditions that cause wetting are: the surface of the board must be clean and free of oxides or contaminants.
The second step is diffusion. As the wetting progresses, the phenomenon of interdiffusion between the solder and the soldered atoms of the board begins to occur. Usually, the atom is in a state of thermal vibration in the lattice lattice. Once the temperature rises, the atomic activity is intensified, and the molten solder and the atoms in the circuit board are crossed over the contact surface to enter each other's lattice lattice, and the atom The speed and quantity of movement depends on the temperature and time of heating.
The third step is metallurgical bonding. Due to the mutual diffusion of the solder and the metal to be welded, an intermediate layer, a metal compound, is formed between the contact faces. It can be seen that in order to obtain a good solder joint, a metal compound must be formed between the soldered metal and the solder, so that the solder joint reaches a firm metallurgical bond state.
In summary, whether a certain metal can be soldered or not is easy to solder depends on two factors: first, whether the solder used can form a compound with the weldment; second, there is a flux that removes the rust on the joint. When soldering, the solder reacts with most metals (such as gold, silver, copper, iron, zinc, etc.) to form a relatively hard and brittle metal compound. This compound is a bond between solder and weldment, but Mainly tin-lead solder, using tin wire as flux and solder, saving waste of raw materials and simplifying the soldering process.
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