Model NO.: GM500
Certification: UL
Color: Grey
Brand: Jrft
Gravity: 2.8+-0.1g/Ml
Viscosity: 180---230 PA.S
Thermal Conductivity: 3.5 W/M.K
Dielectric Strength: 4.5kv/Mm AC
Model NO.: GM500
Certification: UL
Color: Grey
Brand: Jrft
Gravity: 2.8+-0.1g/Ml
Viscosity: 180---230 PA.S
Thermal Conductivity: 3.5 W/M.K
Dielectric Strength: 4.5kv/Mm AC
JRF-GM500 Thermal Grease
Applications:1. Between CPU and the radiator
2.High power CPU, GPU
3.IGBT module
4.Power supply
5.Communication products, PC and NB
Specification:
1KG/ 2KG/ 4KG/ 10KG/ tank
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Storage Conditions:
Stored in a cool and dry place, seal placed
Performance and Advantage:
Thermal conductivity : 3.5W/m-k
Thermal impedance : 0.06ºC-in/W
Extremely low thermal resistance, better transmission heat
Complete wetting contact surface and improve the radiating effect
Safety and environmental protection, through the RoHS certification
Features:
Excellent thermal conductivity, electrical insulation and low temperature performance, high stability and good use.
Water resistance, not curing, metal material on contact without corrosion (copper, aluminum, steel)
Volatilization loss low , not dry, not melting, good material adaptability and large temperature range (good use -50 to +250 DEG C)
Non-toxic, tasteless, non corrosive, physical and chemical properties stability .Â
JRF-GM500 use the nano filling material for thermal conductive enhancosome , with the excellent properties of ceramic powder mixture into. Which has high thermal conductivity and excellent stability and reliability. Thermal grease is a high thermal conductivity, and has low oil from the degree, excellent long-term reliability. It can be used for a long time in the-60ºC~250ºC temperature, To keep the contact surface wetting and excellent thermal stability.
 2.Microwave communications, microwave transmission equipment and dedicated power supply, regulated power supply and other microwave devices surface coating and overall potting;
3.Electronic components, such as transistors, heat transfer, thermal sensor, ballast computer fan power transistor (plastic pipe), diode and base material (aluminum, copper) contact gap heat transfer medium, rectifier and electrical thermal insulation materials;
4.High voltage corona, eliminating non combustible coatings for high voltage fly back transformer ,televisions and similar applications of the connection;
5.Heating various electronic, electrical equipment gaps in between the body and the heating facilities, improving the radiating effect of filling .Â


JRF-GM500 Thermal Grease
Applications:1. Between CPU and the radiator
2.High power CPU, GPU
3.IGBT module
4.Power supply
5.Communication products, PC and NB
Specification:
1KG/ 2KG/ 4KG/ 10KG/ tank
Â
Storage Conditions:
Stored in a cool and dry place, seal placed
Performance and Advantage:
Thermal conductivity : 3.5W/m-k
Thermal impedance : 0.06ºC-in/W
Extremely low thermal resistance, better transmission heat
Complete wetting contact surface and improve the radiating effect
Safety and environmental protection, through the RoHS certification
Features:
Excellent thermal conductivity, electrical insulation and low temperature performance, high stability and good use.
Water resistance, not curing, metal material on contact without corrosion (copper, aluminum, steel)
Volatilization loss low , not dry, not melting, good material adaptability and large temperature range (good use -50 to +250 DEG C)
Non-toxic, tasteless, non corrosive, physical and chemical properties stability .Â
JRF-GM500 use the nano filling material for thermal conductive enhancosome , with the excellent properties of ceramic powder mixture into. Which has high thermal conductivity and excellent stability and reliability. Thermal grease is a high thermal conductivity, and has low oil from the degree, excellent long-term reliability. It can be used for a long time in the-60ºC~250ºC temperature, To keep the contact surface wetting and excellent thermal stability.
 2.Microwave communications, microwave transmission equipment and dedicated power supply, regulated power supply and other microwave devices surface coating and overall potting;
3.Electronic components, such as transistors, heat transfer, thermal sensor, ballast computer fan power transistor (plastic pipe), diode and base material (aluminum, copper) contact gap heat transfer medium, rectifier and electrical thermal insulation materials;
4.High voltage corona, eliminating non combustible coatings for high voltage fly back transformer ,televisions and similar applications of the connection;
5.Heating various electronic, electrical equipment gaps in between the body and the heating facilities, improving the radiating effect of filling .Â


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